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Due to severe global supply shortages, China's two major storage chip manufacturers, Changxin Storage and Yangtze Memory Technologies, have launched the largest expansion plan in history, aiming to narrow the gap with international leaders like Samsung and SK Hynix.

As China's largest DRAM manufacturer, Changxin Storage is building a new factory in Shanghai, with additional capacity expected to reach two to three times that of its Hefei headquarters. The factory is scheduled to begin equipment installation in the second half of 2026 and officially start production in 2027, with products covering server, PC, and automotive electronics fields. At the same time, the company is also expanding its HBM production line in Shanghai, targeting AI computing demand.

According to informed sources, Changxin Storage's two factories in Hefei and Beijing are already operating at full capacity, "Domestic demand is extremely strong, and the company hopes to expand production capacity as soon as possible."

China's leading NAND manufacturer, Yangtze Memory Technologies, is also building its third factory in Wuhan, with plans to start production in 2027.

It has been revealed that Yangtze Memory Technologies has clarified the production capacity planning for the new factory, with 50% of the capacity to be used for DRAM manufacturing in addition to producing NAND; it will also collaborate with local storage packaging companies to develop and produce HBM for artificial intelligence computing scenarios.